WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

A semiconductor device includes a semiconductor chip and a wiring board formed on the semiconductor chip. The wiring board includes a first insulation layer, first conductive patterns on the first layer, first via conductors formed in the first layer and connecting the first patterns and electrode pads of the chip, respectively, a second insulation layer on the first layer, second conductive patterns on the second layer, and second via conductors formed in the second layer and connecting the first conductive patterns and the second patterns, respectively, each second via conductors has a side surface extending through the second layer such that the side surface has a bent portion which changes inclination of the side surface in depth direction of each second via conductor, and the second patterns are positioned to fan in or out with respect to the electrode pads.

主权项

1. A semiconductor device, comprising:
a semiconductor chip; and a wiring board formed on the semiconductor chip, wherein the wiring board comprises a first resin insulation layer, a plurality of first conductive patterns formed on the first resin insulation layer, a plurality of first via conductors formed in the first resin insulation layer such that the plurality of first via conductors is connecting the plurality of first conductive patterns and a plurality of electrode pads of the semiconductor chip, respectively, a second resin insulation layer formed on the first resin insulation layer, a plurality of second conductive patterns formed on the second resin insulation layer, and a plurality of second via conductors formed in the second resin insulation layer such that the plurality of second via conductors is connecting the plurality of first conductive patterns and the plurality of second conductive patterns, respectively, each of the second via conductors has a side surface extending through the second resin insulation layer such that the side surface has a bent portion which changes an inclination of the side surface in a depth direction of each of the second via conductors, and the plurality of second conductive patterns is positioned to fan in or out with respect to the plurality of electrode pads.