Packaging Methods and Packaged Semiconductor Devices

摘要

Packaging methods and packaged semiconductor devices are disclosed. In one embodiment, a packaging method includes providing a first die, partially packaging the first die, and forming a plurality of solder balls on a surface of the partially packaged first die. An epoxy flux is disposed over the plurality of solder balls. A second die is provided, and the second die is partially packaged. The plurality of solder balls is coupled to the partially packaged second die.

主权项

1. A packaged semiconductor device comprising:
a first die coupled to a first substrate; a second die coupled to a second substrate; a molding compound having a top surface extending over the second die and the second substrate; a plurality of solder joints coupled between the first substrate and the second substrate; and an epoxy layer coupled to each of the plurality of solder joints, the epoxy layer adjoining the top surface of the molding compound.