METHOD OF FABRICATING AN INTEGRATED CIRCUIT DEVICE, AND AN INTEGRATED CIRCUIT DEVICE THEREFROM

摘要

A method of fabricating an integrated circuit (IC) device. The method comprises mounting, via a first surface thereof, at least one semiconductor die on to a surface of an IC device package, mounting, via an interconnect surface thereof, at least one fuse component on to a second surface of the at least one semiconductor die, the second surface of the at least one semiconductor die comprising at least one terminal of the at least one active component, the at least one fuse component being mounted such that the interconnect surface of the at least one fuse component is thermally coupled to the second surface of the at least one semiconductor die and electrically coupled to the at least one terminal of the at least one active component, and electrically coupling the at least one fuse component to at least one external connection surface of the IC device package such that the at least one fuse component is electrically coupled in series between the at least one terminal of the at least one active component of the at least one semiconductor die and the at least one external connection surface of the IC device package.