SHOE AND MANUFACTURING METHOD THEREOF

摘要

The present invention relates to a shoe and a manufacturing method thereof, wherein the invention comprises: a shoe upper; a bottom sole for blocking the lower part of the shoe upper; and a sole cover which is extended from the lower part of the upper of the shoe, and enhance the circumference of a sole, wherein an edge of the bottom sole and a lower edge of the sole cover are connected along a lower edge of the upper of the shoe by backstitching, the sole is attached to a lower side of the bottom sole, the sole cover is turned inside out to face the sole such that the sole cover is attached to enclose an outer surface and a lower edge of the sole, and a window is attached to a lower side of the sole including the end of the sole cover. According to the present invention, instead of the existing methods, a new method is performed to manufacture a shoe which has simple shoemaking steps, whereby time and effort for shoemaking can be reduced, and further, said shoe is light and has excellent sweat-absorbing power and high wearability, thereby minimizing fatigue of the feet.

主权项

1. A shoe, comprising:
an upper layer; a bottom layer configured to cover the lower side of the upper layer; and a sole cover which extends from the lower side of the upper layer and surrounds the surroundings of a sole, wherein along the rim of the lower side of the upper layer, the edge of the bottom layer and the rim of the lower side of the sole cover are sewed and connected, and the sole is attached to beneath the bottom layer, and the sole cover is turned inside out to face the sole and is bonded surrounding an outer circumferential surface of the sole and the rim of its lower side, and an insert is attached to beneath the sole including an end portion of the sole cover, and a cushion member is disposed between the bottom layer and the sole and is bonded, wherein the cushion member comprises:
a cushion pad which is attached to a foot heel beneath the bottom layer;a silicon pad which is attached to beneath the bottom layer including the cushion pad; anda memory foam which is attached to beneath the silicon pad.