| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition which is a curable resin composition excellent in storage stability and in which an obtained molded body is excellent in heat resistance and can retain high luminance in long-time use, and to provide an optical semiconductor sealing material obtained by curing the curable resin composition, and further to provide an optical semiconductor device sealed with the optical semiconductor sealing material.SOLUTION: A curable resin composition is a resin composition with a curing property. The curable resin composition contains (A) 100 pts. mass of an epoxy resin, (B) 10-900 pts. mass of a polysiloxane compound represented by an average composition formula (1): R(OR)SiO, (C) an organic aluminum compound, and (D) a compound having at least one hindered amine group in one molecule, as an essential component. |
