发明名称 ELECTRONIC APPARATUS CASE
摘要 <p>PROBLEM TO BE SOLVED: To provide an electronic apparatus case which is small and has excellent cooling performance and pressure performance.SOLUTION: There is provided an electronic apparatus case 1 in which a motherboard 5 is disposed on one surface of a box-shaped chassis 4 having a board housing chamber 3 for storing a plurality of electronic circuit module boards 2 so as to be stored and taken out, and a side surface cover 14 for opening and closing an opening 3a for storing and taking out the boards 2 in/from the board housing chamber 3 is disposed on the surface opposing to the surface of the chassis 4 on which the motherboard 5 is disposed. In the electronic apparatus case, case walls 16a, 16b and 16c with a heat radiation air duct structure for cooling the boards 2 by circulating cooling air in a direction orthogonal to the storing/taking-out direction of the boards 2 are provided on peripheral wall surfaces other than the surface on which the motherboard 5 is disposed surrounding the circumference of the board housing chamber 3. A first opening 20 communicating with an air duct 17 is disposed on one end face of the board housing chamber 3, and a second opening 21 communicating with the air duct 17 is disposed on the other end surface and/or the outer surface of the case wall of the end surface periphery of the board housing chamber 3.</p>
申请公布号 JP2014150156(A) 申请公布日期 2014.08.21
申请号 JP20130017805 申请日期 2013.01.31
申请人 TOSHIBA CORP 发明人 HASEGAWA TAKESHI
分类号 H05K7/20 主分类号 H05K7/20
代理机构 代理人
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