发明名称 SEMICONDUCTOR LIGHT-EMITTING ELEMENT PACKAGE FIXING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting element package fixing structure capable of achieving both an optical axis adjustment mechanism and a heat radiation mechanism.SOLUTION: A CAN-type semiconductor light-emitting element package 1 is fixedly supported by a movable seat 2, and the movable seat 2 is slidably supported by a fixed seat 3. An outer peripheral surface of the movable seat 2 and an inner peripheral surface of the fixed seat 3 have an egg-like or mortar-like curve surface S of the same inclination curvature with an optical axis of the CAN-type semiconductor light-emitting element package 1 as a rotational symmetrical center, and configure an optical axis adjustment mechanism and a heat radiation mechanism securing a heat radiation path.
申请公布号 JP2014150112(A) 申请公布日期 2014.08.21
申请号 JP20130016932 申请日期 2013.01.31
申请人 STANLEY ELECTRIC CO LTD 发明人 SAITO TAKAO
分类号 H01L33/00;G11B7/08;G11B7/12;G11B7/125;G11B7/22;H01L23/02;H01S5/00 主分类号 H01L33/00
代理机构 代理人
主权项
地址