| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inspection circuit, an inspection method, and an inspection device, capable of performing inspection about whether or not electrical connection of a wiring structure is secured, in a nondestructive manner.SOLUTION: An inspection circuit 2 in a semiconductor device 1 comprises an opening and closing circuit 4 having an input terminal 41 electrically connected with a first terminal 12, a drive terminal 43 electrically connected with a second terminal 22, and an output terminal 42 electrically connected with a discharge mechanism 5. In a state that electric connection from the first electrode 10 to the first terminal 12 is performed in a first wiring structure 11, and electric connection from the second electrode 20 to the second terminal 22 is performed in a second wiring structure 21, when electric charge is given to the first and second electrodes 10 and 20, the electric charge given to the second electrode 20 flows to the drive terminal 43 via the second wiring structure 21 to make a part between the input terminal 41 and the output terminal 42 of the opening and closing circuit 4 be in a conduction state, and the electric charge given to the first electrode 10 flows to the discharge mechanism 5 via the first wiring structure 11 and the opening and closing circuit 4.</p> |
