Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method

摘要

A laminate comprising a support (2), a temporary adhesive layer (3), and a wafer (1) having a circuit-forming front surface and a back surface to be processed allows for processing the wafer. The temporary adhesive layer consists of a first temporary bond layer (A) of thermoplastic organosiloxane polymer which is releasably bonded to the front surface of the wafer and a second temporary bond layer (B) of thermosetting modified siloxane polymer which is laid contiguous to the first temporary bond layer and releasably bonded to the support.