COOLER FOR SEMICONDUCTOR MODULE, AND SEMICONDUCTOR MODULE

摘要

There is provided a semiconductor module cooler which can uniformly and stably cool semiconductor devices by resolving an increase in the temperature of only one portion of the semiconductor devices. A semiconductor module cooler, by supplying a refrigerant to a water jacket (2A) from the exterior, cools semiconductor devices disposed on the outer surface of the cooler. An inlet (24) and an outlet (25) are disposed in a left sidewall (2Ab) of the water jacket (2A), and both an inlet portion (21a) and an outlet portion (22a) protrude from the same left sidewall (2Ab). A flow velocity adjustment plate (28) is disposed parallel to fins (2C) in a refrigerant outlet flow path (22) acting as a second flow path disposed spaced parallel from a refrigerant inlet flow path (21) acting as a first flow path. It is possible to adjust a flow velocity distribution with the fins (2C) by utilizing pressure generated when the refrigerant smashes against the flow velocity adjustment plate (28).