发明名称
摘要 PROBLEM TO BE SOLVED: To reform polysilicon grain boundary using a laser beam by efficiently providing the grain boundary with a suitable energy without affecting a substrate portion and a crystalline portion. SOLUTION: A method for reforming polysilicon grain boundary reforms the grain boundary by irradiating polysilicon with a pulse laser beam. The pulse laser beam is a visible light with a wavelength of≥400 nm. The irradiation intensity of the pulse laser beam is an energy density under which the center of the polysilicon crystal grain is not melted. Preferably, the irradiation intensity of the pulse laser beam should be the energy density under which the vicinity of the polysilicon grain boundary is partially melted. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5574312(B2) 申请公布日期 2014.08.20
申请号 JP20080078304 申请日期 2008.03.25
申请人 发明人
分类号 H01L21/20 主分类号 H01L21/20
代理机构 代理人
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