发明名称 |
Sheet sticking apparatus and sticking method |
摘要 |
Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process. |
申请公布号 |
US8807187(B2) |
申请公布日期 |
2014.08.19 |
申请号 |
US201012794431 |
申请日期 |
2010.06.04 |
申请人 |
Lintec Corporation |
发明人 |
Nonaka Hideaki;Kobayashi Kneji |
分类号 |
B29C65/02 |
主分类号 |
B29C65/02 |
代理机构 |
Lowe Hauptman & Ham LLP |
代理人 |
Lowe Hauptman & Ham LLP |
主权项 |
1. A sheet sticking apparatus, comprising:
a table for supporting plate-like objects; a sheet feed-out unit for feeding out a strip of sheet to upper surface sides of the plate-like objects supported by the table; a press roller for pressing said sheet to stick said sheet to the plate-like objects; and cutting means for cutting said sheet, wherein said table is configured to support a plurality of the plate-like objects in a substantially identical plane and for sticking said sheet onto the plate-like objects substantially simultaneously by sticking operation at one time, and wherein said cutting means comprises a single unit for cutting said sheet along the outer peripheries of said plurality of plate-like objects. |
地址 |
Tokyo JP |