发明名称 Sheet sticking apparatus and sticking method
摘要 Wafers W are supported respectively on inner tables 52 of a table 13, and after a strip of sheet S is fed out to the upper surface side of the wafers W, a press roller 14 imparts a press force. The adhesive sheet S is cut along the outer periphery of the wafers by a cutter blade 63 mounted at the free-end side of a robot 15. The robot 15 has a function to exchange the cutter blade 63 with a suction arm 100, to transfer the wafer W from a magazine 200 to the table 13 and to transfer the wafer W stuck with the sheet to the next process.
申请公布号 US8807187(B2) 申请公布日期 2014.08.19
申请号 US201012794431 申请日期 2010.06.04
申请人 Lintec Corporation 发明人 Nonaka Hideaki;Kobayashi Kneji
分类号 B29C65/02 主分类号 B29C65/02
代理机构 Lowe Hauptman & Ham LLP 代理人 Lowe Hauptman & Ham LLP
主权项 1. A sheet sticking apparatus, comprising: a table for supporting plate-like objects; a sheet feed-out unit for feeding out a strip of sheet to upper surface sides of the plate-like objects supported by the table; a press roller for pressing said sheet to stick said sheet to the plate-like objects; and cutting means for cutting said sheet, wherein said table is configured to support a plurality of the plate-like objects in a substantially identical plane and for sticking said sheet onto the plate-like objects substantially simultaneously by sticking operation at one time, and wherein said cutting means comprises a single unit for cutting said sheet along the outer peripheries of said plurality of plate-like objects.
地址 Tokyo JP