Semiconductor device and method of automatically inspecting an appearance of the same

摘要

The invention provides a semiconductor device and a method of automatically inspecting the appearance, which achieves proper recognition of the size of a chipping occurring from an end portion of the semiconductor device toward the element forming region by an automatic appearance inspection machine, and prevents a problem of judging an appearance non-defective product as an appearance defective product. A semiconductor device includes a resin layer extending from an element forming region over a guard ring surrounding the element forming region so as to cover these except a plurality of portions of the guard ring, and a chipping extending from a chip end portion of a semiconductor device toward the end portion of the resin layer. An end portion of the guard ring partially exposed from the resin layer is used as a reference to measure a distance y from the end portion of the guard ring to the end portion of the chipping and a distance x from the end portion of the guard ring to the end portion of the resin layer. The device is judged as an appearance non-defective product when y is larger than x or is judged as an appearance defective product when y is equal to x or y is smaller than x.

主权项

1. A method of automatically inspecting a semiconductor device, comprising:
providing a semiconductor device comprising a guard ring surrounding an element forming region, a passivation film extending from the element forming region over the guard ring and having an end portion beyond the guard ring, a passivation film removed region extending from the end portion of the passivation film to an end portion of the semiconductor device, a resin layer extending from the element forming region over the guard ring and the passivation film so as to cover the guard ring and the passivation film and to have an end portion in the passivation film removed region, a resin layer removed region in which a portion of the resin layer over the guard ring that is parallel to the end portion of the semiconductor device is removed, and a chipping extending from the end portion of the semiconductor device toward the end portion of the resin layer in the passivation film removed region; setting as a reference an end portion of the guard ring exposed in the resin layer removed region; measuring a distance y between the end portion of the guard ring and an end portion of the chipping; measuring a distance x between the end portion of the guard ring and the end portion of the resin layer; and judging the semiconductor device as non-defective when y is larger than x, or judging the semiconductor device as defective when y is equal to x or y is smaller than x.