发明名称 |
Semiconductor devices including bipolar transistors, CMOS transistors and DMOS transistors, and methods of manufacturing the same |
摘要 |
Semiconductor devices having a bipolar transistor, a CMOS transistor, a drain extension MOS transistor and a double diffused MOS transistor are provided. The semiconductor device includes a semiconductor substrate including a logic region in which a logic device is formed and a high voltage region in which a high power device is formed, trenches in the semiconductor substrate, isolation layers in respective ones of the trenches, and at least one field insulation layer disposed at a surface of the semiconductor substrate in the high voltage region. Related methods are also provided. |
申请公布号 |
US8809991(B2) |
申请公布日期 |
2014.08.19 |
申请号 |
US201213707268 |
申请日期 |
2012.12.06 |
申请人 |
SK Hynix Inc. |
发明人 |
Park Sung Kun |
分类号 |
H01L21/8232;H01L27/088 |
主分类号 |
H01L21/8232 |
代理机构 |
William Park & Associates Patent Ltd. |
代理人 |
William Park & Associates Patent Ltd. |
主权项 |
1. A semiconductor device comprising:
a semiconductor substrate including a logic region in which a logic device is formed and a high voltage region in which a high power device is formed; trenches in the semiconductor substrate; isolation layers in respective ones of the trenches; and at least one field insulation layer disposed at a surface of the semiconductor substrate in the high voltage region, wherein the at least one field insulation layer is a local oxidation of silicon (LOCOS) layer that includes a first portion extending into the semiconductor substrate and a second portion upwardly protruding from a top surface of the semiconductor substrate; wherein the first portion of the field insulation layer has a first thickness corresponding to about 40% of a total thickness of the field insulation layer; wherein the second portion of the field insulation layer has a second thickness corresponding to about 60% of the total thickness of the field insulation layer. |
地址 |
Gyeonggi-do KR |