| 发明名称 | 3D IC and 3D CIS structure | ||
| 摘要 | An embodiment integrated circuit includes a first device supporting a first back end of line layer, the first back end of line layer including a first alignment marker, and a second device including a spin-on glass via and supporting a second back end of line layer, the second back end of line layer including a second alignment marker, the spin-on glass via permitting the second alignment marker to be aligned with the first alignment marker using ultraviolet light. | ||
| 申请公布号 | US8810048(B2) | 申请公布日期 | 2014.08.19 |
| 申请号 | US201213622894 | 申请日期 | 2012.09.19 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Kuang Hsun-Chung |
| 分类号 | H01L23/544;H01L27/088 | 主分类号 | H01L23/544 |
| 代理机构 | Slater and Matsil, L.L.P. | 代理人 | Slater and Matsil, L.L.P. |
| 主权项 | 1. An integrated circuit, comprising: a first device supporting a first back end of line layer, the first back end of line layer including a first alignment marker; and a second device including a spin-on glass via and supporting a second back end of line layer, the second back end of line layer including a second alignment marker, the spin-on glass via permitting the second alignment marker to be aligned with the first alignment marker using ultraviolet light; wherein the spin-on glass via vertically aligned with each of the first and second alignment markers. | ||
| 地址 | Hsin-Chu TW | ||