发明名称 |
Adhesive composition, and adhesive sheet, semiconductor apparatus-protective material and semiconductor apparatus using the same |
摘要 |
There is disclosed an adhesive composition comprising the following Components (A), (B) and (C), wherein a minimum melt viscosity of the composition is less than 500 Pa·s, a temperature which gives the minimum melt viscosity is less than 200° C., and, a melt viscosity at 200° C. of the composition is 500 Pa·s or more:
(A) a polymer having a reactive functional group(B) a thermosetting resin(C) a compound having flux activity. As a result, there is provided an adhesive composition which can be suitably used for preparation of a semiconductor apparatus, particularly an adhesive composition which difficultly causes voids between bumps at the bonding, difficultly causes positional divergence of bumps, and difficultly causes voids after completion of solder bonding. |
申请公布号 |
US8808865(B2) |
申请公布日期 |
2014.08.19 |
申请号 |
US201313854469 |
申请日期 |
2013.04.01 |
申请人 |
Shin-Etsu Chemical Co., Ltd. |
发明人 |
Kondo Kazunori |
分类号 |
C08L83/04;C08L63/00 |
主分类号 |
C08L83/04 |
代理机构 |
Oliff PLC |
代理人 |
Oliff PLC |
主权项 |
1. An adhesive composition comprising components (A), (B) and (C) mentioned below, wherein a minimum melt viscosity of the composition is less than 500 Pa·s, a temperature which gives the minimum melt viscosity is less than 200° C., and, a melt viscosity at 200° C. of the composition is 500 Pa·s or more:
(A) a polymer having a reactive functional group (B) a thermosetting resin (C) a compound having flux activity. |
地址 |
Tokyo JP |