| 发明名称 | Resin composition for insulation film | ||
| 摘要 | A resin composition includes (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin; and at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. The resin composition is characterized by specific ingredients and proportions thereof to attain high heat resistance, low dielectric constant Dk, and low dielectric dissipation factor Df, and being halogen-free, and therefore is applicable to protective film of printed circuit boards, insulating protective film of electronic components, and resin insulation film of leadframes. | ||
| 申请公布号 | US8808862(B2) | 申请公布日期 | 2014.08.19 |
| 申请号 | US201213730012 | 申请日期 | 2012.12.28 |
| 申请人 | Elite Material Co., Ltd. | 发明人 | Hsieh Chen-Yu;Yu Yi-Fei |
| 分类号 | B32B27/38;C09D163/00;C09D151/00;C08L63/00;C08L51/00;C08K5/08;C08K5/315;B32B15/092 | 主分类号 | B32B27/38 |
| 代理机构 | WPAT, P.C. | 代理人 | WPAT, P.C. ;King Anthony |
| 主权项 | 1. A resin composition, comprising: (A) 100 parts by weight of epoxy resin; (B) 20 to 100 parts by weight of polybutadiene styrene divinylbenzene graft terpolymer resin; (C) 2 to 20 parts by weight of di-tert-butylhydroquinone (DTBHQ); and (D) 5 to 50 parts by weight of polyphenyl ether modified cyanate ester resin, wherein the resin composition further selectively comprises at least one of (E) inorganic filler, (F) chain extending sealing agent, and (G) catalyst. | ||
| 地址 | Tao-Yuan Hsien TW | ||