TRANSPARENT STACKED FILM, TRANSPARENT CONDUCTIVE FILM, AND GAS BARRIER STACKED FILM

摘要

Provided is a new transparent conductive film having superior transparency and thermal dimensional stability at a high temperature (for example, 200°C), and having a low surface resistance value. Further provided is a new transparent stacked film and a new gas barrier stacked film that can be used as a base material film for the transparent conductive film and in other types of transparent substrates. Provided is a transparent conductive film in which a transparent conductive layer is formed directly or through an undercoat comprising a resin material onto one side or both sides of a cross-linked resin layer of a transparent stacked film having the cross-linked resin layer on at least one surface of a base material film, the transparent conductive film being firstly characterized in that the transparent stacked film has a thermal shrinkage in the vertical direction and in the horizontal direction when heated for 10 minutes at a temperature of 200°C of 1.5% or less, and secondly characterized in that the surface resistance value of the transparent conductive film is 150 &OHgr;/□ or less.