发明名称 |
SEMICONDUCTOR MODULE SYSTEM HAVING ENCAPSULATED THROUGH WIRE INTERCONNECT (TWI) |
摘要 |
A semiconductor module system includes a module substrate and a semiconductor substrate having a through wire interconnect bonded to an electrode on the module substrate. The through wire interconnect includes a via, a wire in the via having a first end bonded to a substrate contact on the semiconductor substrate and a polymer layer at least partially encapsulating the wire. The semiconductor module system can also include a second substrate stacked on the semiconductor substrate having a second through wire interconnect in electrical contact with the through wire interconnect. |
申请公布号 |
US2014225259(A1) |
申请公布日期 |
2014.08.14 |
申请号 |
US201414257114 |
申请日期 |
2014.04.21 |
申请人 |
Micron Technology, Inc. |
发明人 |
Hembree David R;Wood Alan G. |
分类号 |
H01L23/48;H01L21/768;H01L23/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor module system comprising:
a module substrate having an electrode; a semiconductor substrate on the module substrate having a first side, a second side, a substrate contact on the first side, and an integrated circuit in electrical communication with the substrate contact; and a through wire interconnect on the semiconductor substrate comprising a via extending through the semiconductor substrate from the first side to the second side thereof, a wire in the via having a first end with a bonded connection to the substrate contact, a portion in electrical contact with the electrode on the module substrate and a second end proximate to the second side of the semiconductor substrate, and a polymer layer on the first side at least partially encapsulating the wire. |
地址 |
Boise ID US |