| 摘要 |
The present invention relates to a substrate processing apparatus including a process room for processing a substrate with a process fluid; and a supply unit supplying the process fluid to the process room. The supply unit a supply line for supplying the process fluid; a preliminary heater firstly heating the process fluid and installed on the supply line; a main heater secondly heating the process fluid and installed on the supply line under the preliminary heater; a first bypass line having a first valve and connected to the supply line to bypass the preliminary heater; a second bypass line having a second valve, and connected to the supply line to bypass the main heater or the preliminary heater and the main heater; and a controller controlling the first valve and the second valve. The controller controls the first valve and the second valve to circulate the process fluid along the first bypass line and the second bypass line. |
