发明名称 |
Semiconductor Package Including Multiple Chips and Separate Groups of Leads |
摘要 |
Provided is a semiconductor package including multiple semiconductor chips, and separate groups of leads connected to the semiconductor chips. The leads are exposed to the outside of the semiconductor package. The plurality of leads may include a first lead group for a first chip group and a second lead group for a second chip group. The first and second chip groups are part of the package. |
申请公布号 |
US2014225281(A1) |
申请公布日期 |
2014.08.14 |
申请号 |
US201414250934 |
申请日期 |
2014.04.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
Park Chul;Kim Hyeong-seob;Yeom Kun-dae;Lim Gwang-man |
分类号 |
H01L23/535;H01L25/065;H01L23/50 |
主分类号 |
H01L23/535 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Suwon-si KR |