发明名称 ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME
摘要 Provided is an electronic circuit device that forms a parting line so as to not allow the intrusion of moisture inside a connector and that allows for a reduction in manufacturing costs, and a method for manufacturing the same. The electronic circuit device (1) is provided with a resin sealing member (6, 7) for sealing a circuit substrate (2) having electronic components (4) mounted thereon and having a terminal section (5) formed at one end section, the resin sealing member (6) being provided with a parting line (9) that is formed to extend around an axis in the direction for inserting the terminal section (5). The electronic circuit device (1) is obtained by a manufacturing method that uses a die apparatus (21) comprising: an upper die (22) provided with a first cavity section (24) having a shape that follows the contour of the half section (6) of the resin sealing member on the side opposite the terminal section (5); and a lower die (23) provided with a second cavity section (27) having a shape that follows the contour of the half section (7) of the resin sealing member at the terminal section (5) side.
申请公布号 WO2014122867(A1) 申请公布日期 2014.08.14
申请号 WO2013JP84493 申请日期 2013.12.24
申请人 KEIHIN CORPORATION 发明人 KUBOKI, TADAO;SAKAI, SATOSHI
分类号 H01R13/52;B29C45/14;H01R12/72;H01R43/24;H05K1/11;H05K3/00;H05K3/28 主分类号 H01R13/52
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