发明名称 |
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME |
摘要 |
Provided is an electronic circuit device that forms a parting line so as to not allow the intrusion of moisture inside a connector and that allows for a reduction in manufacturing costs, and a method for manufacturing the same. The electronic circuit device (1) is provided with a resin sealing member (6, 7) for sealing a circuit substrate (2) having electronic components (4) mounted thereon and having a terminal section (5) formed at one end section, the resin sealing member (6) being provided with a parting line (9) that is formed to extend around an axis in the direction for inserting the terminal section (5). The electronic circuit device (1) is obtained by a manufacturing method that uses a die apparatus (21) comprising: an upper die (22) provided with a first cavity section (24) having a shape that follows the contour of the half section (6) of the resin sealing member on the side opposite the terminal section (5); and a lower die (23) provided with a second cavity section (27) having a shape that follows the contour of the half section (7) of the resin sealing member at the terminal section (5) side. |
申请公布号 |
WO2014122867(A1) |
申请公布日期 |
2014.08.14 |
申请号 |
WO2013JP84493 |
申请日期 |
2013.12.24 |
申请人 |
KEIHIN CORPORATION |
发明人 |
KUBOKI, TADAO;SAKAI, SATOSHI |
分类号 |
H01R13/52;B29C45/14;H01R12/72;H01R43/24;H05K1/11;H05K3/00;H05K3/28 |
主分类号 |
H01R13/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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