发明名称
摘要 Disclosed herein are thermoplastic compositions that provide electromagnetic/radio frequency interference (EMI/RFI) shielding characteristics to a molded article. The compositions offer improved delamination behavior. The compositions include a polycarbonate resin, a polysiloxane block co-polycarbonate, a conductive filler capable of providing EMI shielding characteristics and optionally other pigments and/or processing additives. The compositions can be used in a variety of applications such as personal computers, notebook and portable computers, cameras, or other electronic devices.
申请公布号 JP2014519538(A) 申请公布日期 2014.08.14
申请号 JP20140511998 申请日期 2012.05.24
申请人 发明人
分类号 C08L69/00;B05D7/02;B32B27/36;C08J7/04;C08K7/04 主分类号 C08L69/00
代理机构 代理人
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