| 摘要 |
A component built-in substrate comprising: a first substrate having a first insulating layer having a first surface and a second surface, a first electroconductive layer formed on the first surface of the first insulating layer, and an interlayer conduction part passing through the first insulating layer, connected to the first electroconductive layer, and protruding from the second surface of the first insulating layer; an electronic component connected with the interlayer conduction part; and a second substrate having a second insulating layer having a first surface, a second surface, and an opening in which the electronic component is built in, and a second electroconductive layer formed on the first surface and/or the second surface of the second insulating layer; the second electroconductive layer having a frame part that is frame-shaped in a plan view, and the opening being formed so as to pass through the second insulating layer in the thickness direction in the entire inside area of the frame part. |
