METHOD FOR INCORPORATING STRESS SENSITIVE CHIP SCALE COMPONENTS INTO RECONSTRUCTED WAFER BASED MODULES

摘要

Techniques for constructing an electronic module are provided herein. For example, the techniques include orienting at least one die having a top side (e.g., a first side), a bottom side (e.g., a second side) and one or more side walls, on a substrate with the top side of the die proximate the substrate, coating the bottom side and each of the side walls of the die with a stress buffer material, forming a reconstructed wafer by encapsulating the coated die within a mold compound, and removing the substrate to expose the top side of the die.

主权项

1. A method for constructing an electronic module having a die with a first side opposing a second side and a sidewall extending between the first side and second side, the method comprising the steps of:
orienting the die on a substrate with the first side of the die proximate the substrate; coating the second side and the side wall the die with a stress buffer material; forming a reconstructed wafer by encapsulating the coated die within a mold compound; and removing the substrate to expose the first side of the die.