HIGH-SPEED TRANSPORTATION MECHANISM FOR MICRO SOLDER BALLS

摘要

Approaches to a solder ball bonding (SBB) tool and a method for solder ball bonding work pieces. The SBB tool comprises a rotatable feed plate for transporting solder balls from a reservoir to a nozzle, which is a position at which a laser light source can irradiate and melt the solder balls. The melted solder ball is then ejected from the nozzle and onto one or more work pieces, for electrically interconnecting the work pieces. The feed plate is configured with first holes and second holes, the first holes for receiving and transporting solder balls and the second holes for providing an aperture for the laser light to irradiate the solder balls, as the feed plate rotates and the holes are moved to positions in relation to the reservoir and the nozzle.

主权项

1. A solder ball bonding (SBB) tool, comprising:
a solder ball reservoir configured for housing solder balls; a rotatable feed plate configured for receiving a solder ball from said reservoir and for feeding said solder ball into a nozzle unit and for guiding laser light from a laser light source onto said solder ball; and said laser light source for at least partially melting said solder ball; and said nozzle unit configured for directing a solder ball into a nozzle and ejecting said solder ball from said nozzle onto a work piece.