| 摘要 |
<p>The objective of the present invention is to improve the elevating property of a substrate while maintaining the polishing property of the substrate. A polishing apparatus (100) comprises a polishing table (110) to which a polishing pad (108) for polishing a substrate (102) is bonded, a liquid supply part which supplies a liquid (109) to the polishing surface of the polishing pad (108), a toppling (116) which adsorbs the substrate (102) which touches the polishing surface by interposing the liquid (109) supplied by the liquid supply part and transfers it from the polishing surface, and a control part which injects a fluid (N2) into the inner region (109a) of the liquid (109) interposed between the polishing pad (108) and the substrate (102) when the substrate (102) is transferred.</p> |
