WIRING BOARD AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wiring board capable of obtaining high solder mounting reliability even if solder whose melting point is less than 140°C is used, and also to provide a method of manufacturing the same.SOLUTION: In a wiring board 1 having an electrode 12 made of Cu or Cu alloy and a solder 26 which is joined onto the electrode 12 by heating and whose melting point is less than 140°C, Pd is melted into the solder 26 and a Pd concentration layer does not exist between the electrode 12 and the solder 26.