FUNCTIONAL MATERIAL SYSTEMS AND PROCESSES FOR PACKAGE-LEVEL INTERCONNECTS

摘要

Interconnect packaging technology for direct-chip-attach, package-on-package, or first level and second level interconnect stack-ups with reduced Z-heights relative to ball technology. In embodiments, single or multi-layered interconnect structures are deposited in a manner that permits either or both of the electrical and mechanical properties of specific interconnects within a package to be tailored, for example based on function. Functional package interconnects may vary one of more of at least material layer composition, layer thickness, number of layers, or a number of materials to achieve a particular function, for example based on an application of the component(s) interconnected or an application of the assembly as a whole. In embodiments, parameters of the multi-layered laminated structures are varied dependent on the interconnect location within an area of a substrate, for example with structures having higher ductility at interconnect locations subject to higher stress.

主权项

1. An integrated electronic device, comprising:
a first substrate with top level interconnect pads and a dielectric material disposed between the pads; and a first multi-layered interconnect stack disposed over a first top level interconnect pad and electrically coupled to the pad, wherein the first multi-layered interconnect stack forms a protrusion extending from the dielectric material a distance sufficient to make first contact with a second substrate, and wherein the first multi-layered interconnect stack comprises layers of at least two distinct materials that are reflowable into a composite interconnect joint.