| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-performance semiconductor package that prevents the occurrence of harmonics, and to provide a method of manufacturing the same.SOLUTION: A semiconductor package includes; a semiconductor chip having a signal input terminal and a signal output terminal; and a cap portion provided on the semiconductor chip and having a recess forming a hollow structure between the recess and the semiconductor chip, a first through electrode electrically connected to the signal input terminal, and a second through electrode electrically connected to the signal output terminal. Opposing first and second surfaces of inner surfaces of the recess are not parallel to each other. |
