| 摘要 |
PROBLEM TO BE SOLVED: To form a structure of a chip type light emitting element so that a joint part is placed in an occupied area of the element in a plane view when the chip type light emitting element is mounted on a wiring board.SOLUTION: A pair of internal electrodes 2 is disposed on one surface 1a of an insulation substrate 1 made of a ceramic and an external electrode 5 is disposed on the other surface 1c. The pair of internal electrodes 2 and the external electrode 5 are electrically connected by a conductive material 7 filling through holes 6 opened in the insulation substrate 1. A light emitting body chip 3 is die-bonded to one of the internal electrodes 2, and the one internal electrode 2 is joined to the other internal electrode 2 by a bonding wire 4. Joint parts of the light emitting body chip 3, the bonding wire 4, and the internal electrodes 2 are protected by a translucent member 8. |
