SENSOR ARRAY PACKAGE

摘要

Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.

主权项

1. A method of forming a low profile assembly, comprising:
forming a signal trench in a substrate; depositing a barrier layer over the substrate proximate the signal trench; depositing a seed layer of metal in the signal trench; depositing a masking layer over the substrate, the barrier layer, and the signal trench; depositing and additional metal over the masking layer; and removing the masking layer and the seed layer to form a final conductive layer in the signal trench.