| 摘要 |
PROBLEM TO BE SOLVED: To achieve a semiconductor device which reduces the need for adjustment after a soldering process and reduces a disposal loss of the semiconductor device, and which has high productivity by inhibiting solder cracks or at least and substantially reducing a depth of the crack.SOLUTION: A semiconductor device according to the present embodiment comprises: an insulating substrate having a surface side conductive pattern and a rear face side conductive pattern; a power semiconductor element bonded to on the surface side conductive pattern of the insulating substrate; a heat spreader which includes an opposite region opposite to the insulating substrate and a crack region around at least a part of the opposite region, and to which the insulating substrate is bonded by a solder, in which solder cracks are produced in the crack region of the heat spreader during cooling time after soldering. |
