METHOD FOR MANUFACTURING PHOTOELECTRIC CONVERSION DEVICE

摘要

Disclosed is a method for manufacturing a crystal silicon-based photoelectric conversion device. A crystalline-based silicon photoelectric conversion device of the present invention comprises: an intrinsic silicon-based layer of a first conductivity type layer-side and a silicon-based layer of a first conductivity type, in this order on one surface of a single-crystal silicon substrate of the first conductivity type; and an intrinsic silicon-based layer of an opposite conductivity type layer-side and a silicon-based layer of an opposite conductivity type, in this order on the other surface of the single-crystal silicon substrate of the first conductivity type. At least one of a step of forming the intrinsic silicon-based layer of first conductivity type layer-side and a step of forming the intrinsic silicon-based layer of opposite conductivity type layer-side includes the sub-steps in the following order: a step of forming a first intrinsic silicon-based thin-film layer having a thickness of 1 nm to 10 nm on the single-crystal silicon substrate of the first conductivity type by a plasma-enhanced CVD method; a step of plasma-treating the single-crystal silicon substrate of the first conductivity type, on which the first intrinsic silicon-based thin-film layer is formed thereon, in an atmosphere of a gas containing hydrogen as a main component; and a step of forming a second intrinsic silicon-based thin-film layer on the first intrinsic silicon-based thin-film layer by a plasma-enhanced CVD method.