发明名称
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing device and a manufacturing method of a substrate for a power module capable of bonding a ceramic substrate and a metal layer in a short time. SOLUTION: A device for manufacturing a substrate 3 for a power module by bonding a laminate 30 in which metal layers 6 and 7 were laminated on a ceramic substrate 2 via a joint material by pressurizing it under a high temperature comprises a pressure plate 40 which is disposed on both surfaces of the laminate 30 and in which an infrared light guide layer 42 is laminated on a carbon layer 41 which comes contact with the laminate 30. COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP5569306(B2) 申请公布日期 2014.08.13
申请号 JP20100219568 申请日期 2010.09.29
申请人 发明人
分类号 H01L23/34;H01L23/12 主分类号 H01L23/34
代理机构 代理人
主权项
地址
您可能感兴趣的专利