Downward-facing optical component module

摘要

A motherboard for an electronic device comprising a main printed circuit board (PCB) with a through-hole extending between the upper component surface and the lower surface. The motherboard includes a carrier PCB having a top surface and a bottom surface, and at least one component, e.g. an optical device, sensor, or the like, coupled to the top surface. The carrier PCB is mounted in an in an inverted orientation with respect to the main PCB such that the top surface of the carrier PCB faces the upper component surface of the main PCB. The carrier PCB is aligned with the main PCB such that the component is substantially aligned with the through hole of the main PCB and is visible from the lower surface of the PCB.

主权项

1. An electronic device, comprising:
a first printed circuit board (PCB); a second PCB configured to be coupled to the first PCB; the first PCB having top and bottom surfaces and at least one component mounted to the top surface of the first PCB prior to the first PCB being coupled to the second PCB; the second PCB comprising a top surface and a bottom surface; the second PCB further comprising a through-hole extending between the top and bottom surfaces of the second PCB; wherein the first PCB is mounted in an inverted orientation with respect to the second PCB such that the top surface of the first PCB faces the top surface of the second PCB; and wherein the first PCB is aligned with the second PCB such that the component is substantially aligned with the through hole of the second PCB and is visible from the bottom surface of the second PCB; wherein the component comprises an optical device that operates in a line of sight through the second PCB toward the bottom surface of the second PCB.