| 主权项 |
1. A directly patterned metal-containing film, article or object formed by the process comprising:
a. applying a photosensitive metal-containing composition on a substrate wherein the photosensitive metal-containing composition comprises: i. a metal-containing precursor unit (MU) containing at least two reactive functional groups, and ii. a photoinitiator or photoactive catalystwhere MU is represented by Structure I:
MAwBxCy Structure Iwhere M comprises a metal with a formal valency of 0-7 and is selected from Zr, Hf, Ge, Ti, Pb, Gd, Sn, Zn, Ni, Ce, Nb, Eu, In, Al, Fe, Mn, Nd, Cu, Sb, Mg, Ga, Se, Cd, Ta, Co, Cr, Pt, Au, W, V, Tl, Te, Sr, Sm, La, Er, Pd, In, Ca, Ba, As and Y; Ligand A contains a reactive functional group capable of undergoing a combining reaction; w is 2 to 7; Ligands B and C are selected individually or in combination from oxygen, nitrogen, sulfur, or a halogen atom; linear, branched or cyclic alkyl, alkenyl or alkynyl group; substituted or unsubstituted aryl group; and —XR1 where X represents an organic functional group such as oxy, thio, carboxy, thiocarboxy, sulfo, oxalate, acetoacetonate, carbanion, carbonyl, thiocarbonyl, cyano, nitro, nitrito, nitrate, nitrosyl, azide, cyanato, isocyanato, thiocyanato, isothiocyanato, amido, amine, diamine, arsine, diarsine, phosphine, and diphosphine, and R1 represents a linear, branched or cyclic alkyl or thioalkyl group, a heterocyclic group, an alicyclic group, and a substituted or unsubstituted aryl or heteroaryl group; and x and y are 0 to 5,
b. drying the photosensitive metal-containing composition at a temperature less than 200° C., c. exposing the photosensitive metal-containing composition to a source of actinic radiation through a mask or a mold followed by development of the unexposed portion of the composition and d. applying to the metal-containing composition a post-treatment selected individually or in combination from thermal, source of high energy ion beam, chemical and plasma. |
