Method and system for calibrating exposure system for manufacturing of integrated circuits

摘要

Method and system for calibrating exposure system for manufacturing of integrated circuits. According to an embodiment, the present invention provides a method for determining one or more focus parameters for an exposure system. As an example, the exposure system is used for forming patterns on semiconductor wafer. The method includes a step for providing a semiconductor wafer. The semiconductor wafer is characterized by a diameter. The method also includes a step for forming a plurality of patterns using the exposure system on the semiconductor wafer. As an example, each of the plurality of patterns being associated with a focus reference value (e.g., focus distance, focus angle, etc.). The method additionally includes a step for determining a plurality of shift profiles, and each of the shift profile is associated one of the plurality of patterns.

主权项

1. A method for determining one or more focus parameters for an exposure system, the exposure system being used in photolithographic processes in manufacturing integrated circuits, the method comprising:
forming a first plurality of patterns and a second plurality of patterns using the exposure system on a semiconductor wafer, each of the plurality of patterns being associated with one or more known focus parameters, wherein the first plurality of patterns is configured such that a focused portion thereof is shifted in a first direction when the exposure system is out of focus, and the second plurality of patterns is configured such that a focused portion thereof is shifted in a second direction opposite the first direction when the exposure system is out of focus; obtaining characteristics for each of the first plurality and the second plurality of patterns using an optical measuring device; and determining a focus position for the exposure system associated with a minimal relative shift, wherein forming the first plurality of patterns includes forming the following plurality of lines and spaces in an order along a first direction:
a first line having a width that is at a photoresist resolution line width limit;a first space having a width that is at a photoresist resolution spacing limit;a second line having a width that is at a line width for a critical photo step;a second space having a width that is at a normal photoresist spacing resolution;a third line having a width that is at a line width for a non-critical photo step;a third space having a width that is at a normal photoresist spacing resolution; anda fourth line having a width that is at a line width for a stable overlay measurement; wherein forming the second plurality of patterns includes forming said plurality of lines and spaces in an opposite order along the first direction.