| 发明名称 |
Combination of a substrate and a wafer |
| 摘要 |
The invention pertains to a combination of a substrate and a wafer, wherein the substrate and the wafer are arranged parallel to one another and bonded together with the aid of an adhesive layer situated between the substrate and the wafer, and wherein the adhesive is chosen such that its adhesive properties are neutralized or at least diminished when a predetermined temperature is exceeded. According to the invention, the adhesive layer is only applied annularly between the substrate and the wafer in the edge region of the wafer. |
| 申请公布号 |
US8802542(B2) |
申请公布日期 |
2014.08.12 |
| 申请号 |
US201313947265 |
申请日期 |
2013.07.22 |
| 申请人 |
|
发明人 |
Thallner Erich |
| 分类号 |
H01L21/30;H01L21/67;H01L21/683;H01L21/02;H01L21/20 |
主分类号 |
H01L21/30 |
| 代理机构 |
Kusner & Jaffe |
代理人 |
Kusner & Jaffe |
| 主权项 |
1. A method for handling a substrate for temporarily bonding to a wafer, the method comprising the step of:
fixing the wafer on the substrate by applying a first fluid adhesive layer that contacts at least an outer peripheral edge of the substrate before the bonding process and a second fluid adhesive layer that contacts at least the outer peripheral edge of the wafer before the bonding process. |
| 地址 |
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