发明名称 Nonvolatile semiconductor memory device and method of fabricating the same
摘要 In one embodiment, a nonvolatile semiconductor memory device includes a substrate; a tunnel insulating film on the substrate; a charge storage layer on the tunnel insulating film; a block insulating film on the charge storage layer; a first element isolation insulating film in an element isolation trench in the substrate, having a bottom surface lower than an interface between the substrate and the tunnel insulating film, and having a top surface lower than an interface between the charge storage layer and the block insulating film; a second element isolation insulating film on the first element isolation insulating film, protruding to a top surface of the block insulating film, in contact with a side surface of the block insulating film, and having a higher Si concentration than the block insulating film; and a control gate electrode on the block insulating film and on the second element isolation insulating film.
申请公布号 US8803221(B2) 申请公布日期 2014.08.12
申请号 US201113231776 申请日期 2011.09.13
申请人 Kabushiki Kaisha Toshiba 发明人 Kai Tetsuya;Ozawa Yoshio
分类号 H01L29/792 主分类号 H01L29/792
代理机构 Knobbe Martens Olson & Bear LLP 代理人 Knobbe Martens Olson & Bear LLP
主权项 1. A nonvolatile semiconductor memory device comprising: a semiconductor substrate comprising an element isolation trench; a tunnel insulating film on the semiconductor substrate; a charge storage layer on the tunnel insulating film; a block insulating film on the charge storage layer; a first element isolation insulating film in the element isolation trench, the first element isolation insulating film having a bottom surface lower in level than an interface where the semiconductor substrate and the tunnel insulating film are in contact with each other, the first element isolation insulating film having a top surface lower in level than an interface where the charge storage layer and the block insulating film are in contact with each other; a second element isolation insulating film on the first element isolation insulating film, the second element isolation insulating film protruding to a top surface of the block insulating film and being in contact with a side surface of the block insulating film, the second element isolation insulating film having a higher Si concentration than the block insulating film; and a control gate electrode on the block insulating film and on the second element isolation insulating film.
地址 Tokyo JP