| 摘要 |
The present invention relates to an adhesive material for flip-chip-type electron packaging. The present invention relates to an electron packaging method using a non-conductive polymer adhesive material for electron packaging that includes a thermoset, thermalplastic, filler, hardener, and hardening accelerator. The hardener is an anhydrization material generating electron pair (Lewis base). [Reference numerals] (AA) START;(BB) END;(S10) Form a space between an electronic element and a printed circuit board;(S20) Locate a nonconducting polymer adhesive;(S30) Raise the temperature while pressurizing;(S40) Remove pressure;(S50) Raise the temperature again |
