METHOD AND APPARATUS FOR CUTTING SEMICONDUCTOR WAFERS USING WIRE SAW

摘要

The present invention relates to a technique for cutting a semiconductor wafer. More particularly, the present invention relates to a method for cutting a semiconductor wafer which prevents the breakage of multiple wafers generated due to the high viscosity of slurry when a chuck moves upwards in a wire sawing process. According to the present invention, a wire is fixed before the chuck is elevated, and then the wire is cut by using a cutter, thereby preventing direct damage to the wafer.