SEMICONDUCTOR DEVICE HAVING MULTI-CAPSULATING LAYER AND METHOD FOR MANUFACUTRING THE SAME

摘要

The present invention relates to a semiconductor device having a multi-sealing layer having improved resistance to moisture permeation which comprises: a substrate; an unsealed semiconductor stack which is disposed on the upper part of the substrate; and a sealing unit which is disposed on the upper part of the semiconductor stack and seals the semiconductor stack with the substrate. The sealing unit includes at least one first inorganic material layer composed of SiOC and at least one second inorganic material layer composed of inorganic materials different from the first inorganic material layer.