| 摘要 |
The objective of the present invention is to provide a polishing apparatus which is to prevent a polishing solution from being attached to a polishing head and also to prevent a dried polishing solution from being dropped on a polishing surface. A polishing apparatus comprises a polishing table (5) which supports a polishing unit (3) having a polishing surface (3a), a polishing head (4) which has a toppling (15) for pressurizing a substrate (W) with the polishing surface (3a), a polishing head cover (50) which covers the polishing head (4), a first cleaning solution supply unit (54) which supplies a cleaning solution onto the outer surface (50a) of the polishing head cover (50), and a second cleaning solution supply unit (61) which supplies a cleaning solution onto the inner surface (50b) of the polishing head cover (50). |
