| 摘要 |
The present invention relates to silicone resin and a method to manufacture thereof and, more specifically, to the silicone resin and the method to manufacture thereof useful to manufacture protective layers of a semiconductor and a display by maintaining high adhesion with materials at high temperature and humidity of the environment, and are useful to protect devices from post process scratches after making the layers made at a reduced processing cost by maintaining high hardness during curing at low temperature, and by overcoming physical properties (adhesion of heat resistance/light, hardness, and at high temperature and humidity) of organic resin (acrylic-epoxy), which are the ingredients for the display and semiconductor to require high adhesion. |
