INTEGRATED THIN FILM EVAPORATION THERMAL SPREADER AND PLANAR HEAT PIPE HEAT SINK

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipation device and heat dissipation method that provides thermal spreading and thermal cooling for a heat-producing body.SOLUTION: A thin film evaporator in thermal communication with the heat-producing body removes heat from the heat-producing body using a working fluid. A heat pipe integrated with and extending from the thin film evaporator dissipates heat removed by the thin film evaporator to the external environment of the heat dissipation device. A pumping element is configured to 1) pump the working fluid to the thin film evaporator and/or 2) augment transfer of the working fluid to the thin film evaporator.