| 摘要 |
PROBLEM TO BE SOLVED: To provide a miniaturized thermal head.SOLUTION: A thermal head X1 comprises: a substrate 7; a heating part 9 provided on the substrate 7; an IC terminal 4 provided on the substrate 7; an external terminal 2 which is provided on the substrate 7 and is connected to the exterior; a common electrode 17 for connecting the heating part 9 and the external terminal 2 to each other; an individual electrode 19 for connecting the heating part 9 and the IC terminal 4 to each other; a signal electrode 8 for connecting the IC terminal 4 and the external terminal to each other; a first ground electrode 6 for connecting the IC terminal 4 and the external terminal 2 to each other; and a drawal electrode 10 for connecting an electronic component 12 mounted onto the substrate 7 and the external terminal 2 to each other. In plan view, the first ground electrode 6, the signal electrode 8, the common electrode 17 and the individual electrode 19 are disposed on one side further than the external terminal 2, the signal electrode 8 is so disposed as to surround the first ground electrode 6, the common electrode 17 is so disposed as to surround the signal electrode 8, and further, the drawal electrode 10 is drawn towards the other side further than the external terminal 2. |
