发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the reliability of reading a code formed on a semiconductor device.SOLUTION: A method of manufacturing a semiconductor device in an embodiment includes a step of evaluating the identification property of a code M2 of an inspection object for a semiconductor chip, a sealing body that seals the semiconductor chip, and the inspection object that has the code M2 which is formed on the sealing body. Evaluation items for an evaluation criterion for evaluating the identification property include the evaluation of a difference between the average luminance value of a bright cell CL2 and the average luminance value of a dark cell CL1.
申请公布号 JP2014142729(A) 申请公布日期 2014.08.07
申请号 JP20130009705 申请日期 2013.01.23
申请人 RENESAS ELECTRONICS CORP 发明人 MINETA TOKUAKI
分类号 G06K5/00;G06K1/12;G06K7/10;H01L23/00;H01L23/28 主分类号 G06K5/00
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