METHOD OF MANUFACTURING A RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF AS WELL AS RIGID-FLEX PRINTED CIRCUIT BOARD OR A SUB-ASSEMBLY THEREOF

摘要

A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprises the following steps:
providing a layer of rigid insulating materialremoving at least one area of the rigid insulating materialinserting a flexible insulating material into the removed or cut-out area(s) of the rigid insulating materialcovering the rigid and flexible insulating material with a layer of conductive material on at least one surfacebuilding up at least one further layer of the rigid-flex printed circuit board at least on the rigid part(s) of the insulating material,

wherein the at least one further layer of the rigid-flex printed circuit board is partly overlapping the flexible area(s) of the insulating material.
;Furthermore a rigid-flex printed circuit board or sub-assembly thereof is provided.

主权项

1. A method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof comprising the following steps:
providing a layer of rigid insulating material removing at least one area of the rigid insulating material inserting a flexible insulating material into the removed or cut-out area(s) of the rigid insulating material covering the rigid and flexible insulating material with a layer of conductive material on at least one surface building up at least one further layer of the rigid-flex printed circuit board at least on the rigid part(s) of the insulating material, wherein the at least one further layer of the rigid-flex printed circuit board is partly overlapping the flexible area(s) of the insulating material.