发明名称 COOLING ASSEMBLY AND DEHUMIDIFICATION METHOD
摘要 A cooling assembly includes a device chamber containing a device chamber cooling medium, a heat exchanger including at least one cooling surface in contact with the device chamber cooling medium, a control unit configured to control the heat exchanger, a humidity sensor configured to detect a humidity level in the device chamber, and a receptacle. The control unit is configured to perform a dehumidification operation as a response to the humidity level exceeding a predetermined threshold value in the device chamber. The dehumidification operation includes lowering a temperature of the at least one cooling surface in order to condensate water from the device chamber cooling medium on the at least one cooling surface. The receptacle is configured to receive water dripping from the at least one cooling surface.
申请公布号 US2014216069(A1) 申请公布日期 2014.08.07
申请号 US201414172257 申请日期 2014.02.04
申请人 ABB Oy 发明人 KOIVULUOMA Timo;MANNINEN Jorma
分类号 F25D29/00 主分类号 F25D29/00
代理机构 代理人
主权项 1. A cooling assembly comprising: a device chamber containing a device chamber cooling medium; heat exchanger means comprising at least one cooling surface in contact with the device chamber cooling medium; control means for controlling the heat exchanger means; humidity sensor means for detecting a humidity level in the device chamber; and a receptacle, wherein the control means is configured to perform a dehumidification operation as a response to the detected humidity level exceeding a predetermined threshold value in the device chamber, wherein the dehumidification operation comprises lowering a temperature of the at least one cooling surface to condensate water from the device chamber cooling medium on the at least one cooling surface, and wherein the receptacle is configured to receive water dripping from the at least one cooling surface.
地址 Helsinki FI